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IBM offers volume chips using SiGe process

IBM offers volume chips using SiGe process

IBM has introduced the first standard, high-volume chips built using its silicon germanium (SiGe) manufacturing process.

The chips target applications such as cellular phones, pagers, and other wireless communications devices; they are intended to extend battery life; carry out multiple functions; and result in smaller, lighter, and less expensive hardware.

IBM pioneered SiGe as an alternative high-speed chip material for mainframe computing. It competes for high-speed applications with gallium arsenide (GaAs), an expensive material that can be difficult to handle.

Last month, CommQuest, a wholly owned IBM subsidiary, announced it was incorporating SiGe technology into its offerings for wireless handsets.

Several of the chips are lower-cost replacements for existing IBM GaAs-based parts.


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