Sony, which expects more mobile devices such as mobile phones to include digital cameras, plans to open a semiconductor development centre for imaging device modules in Taipei on January 1, 2003.
The centre, to be called System in Module Engineering of Taiwan, will be part of Sony Taiwan and will focus on the development of imaging device modules and LSI (large scale integrated) chips for mobile devices such as camera-equipped mobile phones, PDAs (personal digital assistants) and notebook PCs.
Sony expects to see demand for devices like camera-equipped mobile phones to grow and chose to place the design centre in Taiwan because of its status as an important production base for a wide range of communication devices. Putting the centre in Taipei allows Sony to work more closely with Taiwanese manufacturers to develop camera-equipped mobile devices, the company said.
Based on Sony's existing sensor technology for imaging device modules, the centre will develop technologies for the modularisation and optical designs of mobile imaging products in cooperation with Taiwanese companies, universities and public research institutes, Sony said.