German chip maker Infineon Technologies has designed a core transceiver for a new generation of system-on-chip semiconductors that will allow consumer electronic devices, such as mobile phones and PCs, to send or receive data at high speeds over the airwaves, the company said Wednesday.
The dual-band UWB (ultra-wideband) RF (radio frequency) transceiver is based on a low-power CMOS (complementary metal oxide semiconductor) process, Infineon said. It supports both the 3 GHz-to-5 GHz frequency band and above the 6 GHz band up to 9 GHz, as defined by the WiMedia Alliance, an industry consortium.
Infineon will produce the single-chip UWB transceiver using the 90 nanometer CMOS manufacturing process, which enables compact, low-power designs ideal for mobile handset applications, the company said. The nanometer measurement refers to the smallest circuit features etched into the chip.
The tranceiver will support data transmission speeds up to 480M bps (bits per second). It is well suited for both Certified Wireless USB (Universal Serial Bus) and Bluetooth-over-WiMedia UWB systems, according to Infineon.
"Today, you need a cable if you're going to download a huge file, such as a video clip, to your mobile phone," said Infineon spokesman Reiner Schonrock. "With the single-chip UWB device, you won't need cables anymore."
Infineon expects to have the devices ready to ship by mid-2007.